- All sections
- C - Chemistry; metallurgy
- C09J - Adhesives; non-mechanical aspects of adhesive processes in general; adhesive processes not provided for elsewhere; use of materials as adhesives
- C09J 165/00 - Adhesives based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Adhesives based on derivatives of such polymers
Patent holdings for IPC class C09J 165/00
Total number of patents in this class: 110
10-year publication summary
|
8
|
11
|
10
|
15
|
8
|
7
|
10
|
4
|
5
|
2
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Bostik SA | 602 |
15 |
| Centre National de La Recherche Scientifique | 9632 |
10 |
| Universite de Rennes 1 | 434 |
10 |
| 3m Innovative Properties Company | 18406 |
8 |
| The Boeing Company | 19843 |
4 |
| Nitto Denko Corporation | 7879 |
4 |
| Henkel AG & Co. KGaA | 10129 |
4 |
| General Electric Company | 18133 |
3 |
| Zeon Corporation | 3854 |
3 |
| BASF SE | 19740 |
2 |
| Shin-Etsu Chemical Co., Ltd. | 5132 |
2 |
| e Ink Corporation | 1411 |
2 |
| fischerwerke GmbH & Co. KG | 373 |
2 |
| H.B. Fuller Company | 370 |
2 |
| Soken Chemical & Engineering Co., Ltd. | 249 |
2 |
| Trustees of Tufts College | 743 |
2 |
| E. I. du Pont de Nemours and Company | 4345 |
1 |
| Evonik Degussa GmbH | 1574 |
1 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
1 |
| Samsung SDI Co., Ltd. | 6671 |
1 |
| Other owners | 31 |